2026-09-20T13:01:40Z https://www.ideals.illinois.edu/oai-pmh

oai:www.ideals.illinois.edu:2142/81930 2023-07-11 col_2142_5131 col_2142_10761 com_2142_5130 com_2142_10755 com_2142_234

Kang, Sung-Mo (Steve) Li, Tong 2015-09-25T20:21:02Z 2015-09-25T20:21:02Z 10000-01-01 1998 1998 Thermal failure is one of the most prevalent failure mechanism during the Human Body Model (HBM) ESD stress. Previous circuit thermal model (integrator circuit) in iETSIM only applies for constant current stress. A general thermal model using convolution is developed. New techniques are proposed to implement a thermal convolver, including regionwise-exponential (RWE) approximation and recursive convolution. The efficiency of the new thermal convolver makes it feasible to simulate a CMOS circuit containing many devices within a short time. Made available in DSpace on 2015-09-25T20:21:02Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 9912304.pdf: 5737192 bytes, checksum: e7200d3ae5882fe14502961afa302e09 (MD5) Previous issue date: 1998 Embargo set by: Seth Robbins for item 83211 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs U of I Only 137 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1998. http://hdl.handle.net/2142/81930 (MiAaPQ)AAI9912304 eng Engineering, Electronics and Electrical Design Automation for Reliable CMOS Chip Input/output Circuits text Computer Science Computer Science University of Illinois at Urbana-Champaign Dissertation Ph.D.