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oai:www.ideals.illinois.edu:2142/82419 2023-07-11 col_2142_5131 col_2142_11615 com_2142_5130 com_2142_9130 com_2142_8903

Alkire, Richard C. Younker, Jennifer Lauren 2015-09-25T20:43:39Z 2015-09-25T20:43:39Z 10000-01-01 2008 2008 This thesis describes the design and execution of experiments suitable for extracting quantitative information needed for numerical simulation of the effect of plating solution additives on copper nucleation on ruthenium films. This investigation contributes procedures for quantitative characterization of the effect of additives on early stages of copper electrodeposition on ruthenium substrates. Such procedures will enable improved engineering methods for prediction, design, control, and optimization of electrodeposition processes for growth of thin films on foreign substrates. Made available in DSpace on 2015-09-25T20:43:39Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 3347567.pdf: 1946453 bytes, checksum: a504fd4f4b5f8d166cf138400653fe53 (MD5) Previous issue date: 2008 Embargo set by: Seth Robbins for item 83700 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs U of I Only 130 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008. http://hdl.handle.net/2142/82419 (MiAaPQ)AAI3347567 eng Engineering, Chemical Investigation of the Effects of Solution Additives on Nucleation and Growth During Copper Electrodeposition Onto Resistive Ruthenium Barrier Layers text Chemical Engineering Chemical Engineering University of Illinois at Urbana-Champaign Dissertation Ph.D.