<?xml version="1.0" encoding="UTF-8"?>
<?xml-stylesheet type="text/xsl" href="/oai-pmh.xsl"?>
<OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd">
  <responseDate>2026-09-23T02:17:51Z</responseDate>
  <request identifier="oai:www.ideals.illinois.edu:2142/82738" metadataPrefix="etdms" verb="GetRecord">https://www.ideals.illinois.edu/oai-pmh</request>
  <GetRecord>
    <record>
      <header>
        <identifier>oai:www.ideals.illinois.edu:2142/82738</identifier>
        <datestamp>2023-07-11</datestamp>
        <setSpec>col_2142_5131</setSpec>
        <setSpec>col_2142_13836</setSpec>
        <setSpec>com_2142_5130</setSpec>
        <setSpec>com_2142_13835</setSpec>
        <setSpec>com_2142_234</setSpec>
      </header>
      <metadata>
        <thesis xmlns="http://www.ndltd.org/standards/metadata/etdms/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:dc="http://purl.org/dc/elements/1.1/" xsi:schemaLocation="http://www.ndltd.org/standards/metadata/etdms/1.1/ http://www.ndltd.org/standards/metadata/etdms/1.1/etdms11.xsd http://purl.org/dc/elements/1.1/ http://www.ndltd.org/standards/metadata/etdms/1.1/etdmsdc.xsd">
          <dc:contributor>Payne, David A.</dc:contributor>
          <dc:creator>Mikalsen, Erik Arthur</dc:creator>
          <dc:date>2015-09-25T20:52:46Z</dc:date>
          <dc:date>2015-09-25T20:52:46Z</dc:date>
          <dc:date>10000-01-01</dc:date>
          <dc:date>2003</dc:date>
          <dc:date>2003</dc:date>
          <dc:description>The shrinkage and densification of sol-gel layers were determined by  in-situ and ex-situ measurements, where a &amp;sim;30% decrease in thickness (t) was typical during drying of sol-gel layers (T &lt; 300&amp;deg;C). Constrained shrinkage, resulting from adhesion to the supporting silicon substrate, led to a coherent (crack-free) film with biaxial stresses of &amp;sim;200 MPa (t &amp;sim; 50 nm). For ODTS-mediated sol-gel films, however, precise in-situ wafer curvature measurements determined that film stresses never exceeded 75 MPa. Additionally, interfacial adhesive strength between the substrate and the sol-gel film were evaluated for the first time using a unique pulsed-laser stress-wave technique. An adhesive strength threshold of 15 MPa was determined for sol-gel films on ODTS-functionalized silicon, whereas, the threshold strength of films deposited on unmodified silicon was determined as &gt;25 MPa and greater than the fracture strength of silicon. In this work, hydrophobic surface regions, facilitated by directed mu-CP of a molecular film, affected adhesion so as to reduce the substrate constraint and promote de-cohesion of the sol-gel film on the sub-micron scale. That is, selective de-cohesion and lift-off were enabled by the control of local mechanical interfacial constraints.</dc:description>
          <dc:description>Made available in DSpace on 2015-09-25T20:52:46Z (GMT). No. of bitstreams: 2
license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5)
3086141.pdf: 13293065 bytes, checksum: cc2603ed63c917994ce35828b1574c5c (MD5)
  Previous issue date: 2003</dc:description>
          <dc:description>Embargo set by: Seth Robbins for item 84019
Lift date: Forever
Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs</dc:description>
          <dc:description>Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs</dc:description>
          <dc:description>U of I Only</dc:description>
          <dc:description>231 p.</dc:description>
          <dc:description>Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2003.</dc:description>
          <dc:identifier>http://hdl.handle.net/2142/82738</dc:identifier>
          <dc:identifier>(MiAaPQ)AAI3086141</dc:identifier>
          <dc:language>eng</dc:language>
          <dc:subject>Engineering, Materials Science</dc:subject>
          <dc:title>Mediated Patterning of Sol -Gel Thin Layers: Shrinkage, Decohesion, and Lift-Off</dc:title>
          <dc:type>text</dc:type>
          <degree>
            <department>Materials Science and Engineering</department>
            <discipline>Materials Science and Engineering</discipline>
            <grantor>University of Illinois at Urbana-Champaign</grantor>
            <level>Dissertation</level>
            <name>Ph.D.</name>
          </degree>
        </thesis>
      </metadata>
    </record>
  </GetRecord>
</OAI-PMH>
