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oai:www.ideals.illinois.edu:2142/82904 2023-07-11 col_2142_5131 col_2142_13836 com_2142_5130 com_2142_13835 com_2142_234

Economy, James Schneggenburger, Lizabeth Ann 2015-09-25T20:53:33Z 2015-09-25T20:53:33Z 10000-01-01 1998 1998 First, the foaming methods used to lower the dielectric constant of the copolyester thermoset to 2.5 $\rm (25\sp\circ C,$ 1 kHz) are described. Second, the nature of the increase in melting temperature of the liquid crystalline copolyesters upon annealing near their original melting temperature to improve the dimensional stability is elucidated. Lastly, a description of a new photosensitive copolyester dielectric insulator is presented. Made available in DSpace on 2015-09-25T20:53:33Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 9834738.pdf: 3853539 bytes, checksum: 15b044db3621482bcc8f1a600b5577cc (MD5) Previous issue date: 1998 Embargo set by: Seth Robbins for item 84185 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs U of I Only 160 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1998. http://hdl.handle.net/2142/82904 (MiAaPQ)AAI9834738 eng Engineering, Packaging Design of Improved Polyester Dielectric Insulators for Electronic Packaging text Materials Science and Engineering Materials Science and Engineering University of Illinois at Urbana-Champaign Dissertation Ph.D.