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          <dc:contributor>Al-Qadi, Imad L.</dc:contributor>
          <dc:creator>Yang, Shih-Hsien</dc:creator>
          <dc:date>2015-09-25T21:04:40Z</dc:date>
          <dc:date>2015-09-25T21:04:40Z</dc:date>
          <dc:date>10000-01-01</dc:date>
          <dc:date>2009</dc:date>
          <dc:date>2009</dc:date>
          <dc:description>In addition to the mechanical characterization of the sealant material, microstructure of the sealants were also investigated by confocal laser scanning microscopy (CLSM), environmental scanning electron microscopy (ESEM), gel-permeation chromatography (GPC), Fourier-transform infrared spectroscopy (FTIR), and thermo-gravimetric analysis (TGA). These techniques reveal the composition of sealant as well as the interaction between the components and are used to assist the understanding of various sealant mechanical behaviors. The results of the microstructure analysis show that with polymer modification, the low temperature tensile property of the sealant improves. However, if the ground tire rubber (GTR) is added, the improvement of tensile property is reduced, but the flexural strength is increased.</dc:description>
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  Previous issue date: 2009</dc:description>
          <dc:description>Embargo set by: Seth Robbins for item 84678
Lift date: Forever
Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs</dc:description>
          <dc:description>Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs</dc:description>
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          <dc:description>205 p.</dc:description>
          <dc:description>Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2009.</dc:description>
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          <dc:identifier>(MiAaPQ)AAI3363119</dc:identifier>
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          <dc:subject>Engineering, Civil</dc:subject>
          <dc:title>Test Development and Material Characterization of Hot Poured Crack Sealant at Low Temperature</dc:title>
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            <department>Civil Engineering</department>
            <discipline>Civil Engineering</discipline>
            <grantor>University of Illinois at Urbana-Champaign</grantor>
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            <name>Ph.D.</name>
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