2026-09-21T23:51:44Z https://www.ideals.illinois.edu/oai-pmh

oai:www.ideals.illinois.edu:2142/83813 2023-07-11 col_2142_5131 col_2142_14787 com_2142_5130 com_2142_9630 com_2142_234

Philpott, Michael L. Shannon, Mark A. Jiang, Bo 2015-09-25T21:12:16Z 2015-09-25T21:12:16Z 10000-01-01 2004 2004 To further improve form accuracy obtained on the compliant grinding apparatus, a normal grinding force model and a depth of cut model were developed to account for the large compliance in the grinding system. Numerical simulation was performed to predict actual depths of cut and the results were within 6% of the measured/actual depths. Made available in DSpace on 2015-09-25T21:12:16Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 3153333.pdf: 13163289 bytes, checksum: e35c91eed7885090fce2addbf16ab149 (MD5) Previous issue date: 2004 Embargo set by: Seth Robbins for item 85094 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs U of I Only 186 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2004. http://hdl.handle.net/2142/83813 (MiAaPQ)AAI3153333 eng Engineering, Materials Science Compliant Meso-Scale Grinding of Silicon text Mechanical Engineering Mechanical Engineering University of Illinois at Urbana-Champaign Dissertation Ph.D.