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oai:www.ideals.illinois.edu:2142/83884 2023-07-11 col_2142_5131 col_2142_14787 com_2142_5130 com_2142_9630 com_2142_234

Saif, M. Taher A. Han, Jong Hee 2015-09-25T21:12:35Z 2015-09-25T21:12:35Z 10000-01-01 2007 2007 100-nm-thick Al films deposited at two different conditions and having different grain sizes were compared for their thermal behavior by in-situ TEM annealing. The sample having grain size of 250 nm showed grain growth while that with 55-nm grains displayed no grain growth up to melting. The difference is attributed to larger concentration of oxygen in the latter sample. However, when the film having 55-nm grain size was interfaced with a SiO 2 layer, grain growth was seen near the melting, possibly because of the increased stress induced from thermal mismatch. Also, 4-point electrical resistance measurement was performed on 100-nm thick Al film. Its temperature-dependent response was normal metallic linear behavior except that the initial resistivity was about 10 times higher than the bulk value. Made available in DSpace on 2015-09-25T21:12:35Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 3290243.pdf: 3963553 bytes, checksum: 501111c9cf33a14e62f0ad1e19eb52bd (MD5) Previous issue date: 2007 Embargo set by: Seth Robbins for item 85165 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs U of I Only 133 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2007. http://hdl.handle.net/2142/83884 (MiAaPQ)AAI3290243 eng Engineering, Mechanical In-Situ Micro Testing Techniques for Electro-Thermo-Mechanical Characterization of Nano/micro-Scale Materials text Mechanical Engineering Mechanical Engineering University of Illinois at Urbana-Champaign Dissertation Ph.D.