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        <identifier>oai:www.ideals.illinois.edu:2142/83892</identifier>
        <datestamp>2023-07-11</datestamp>
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        <thesis xmlns="http://www.ndltd.org/standards/metadata/etdms/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:dc="http://purl.org/dc/elements/1.1/" xsi:schemaLocation="http://www.ndltd.org/standards/metadata/etdms/1.1/ http://www.ndltd.org/standards/metadata/etdms/1.1/etdms11.xsd http://purl.org/dc/elements/1.1/ http://www.ndltd.org/standards/metadata/etdms/1.1/etdmsdc.xsd">
          <dc:contributor>Polycarpou, Andreas A.</dc:contributor>
          <dc:creator>Xue, Xiaojie</dc:creator>
          <dc:date>2015-09-25T21:12:37Z</dc:date>
          <dc:date>2015-09-25T21:12:37Z</dc:date>
          <dc:date>10000-01-01</dc:date>
          <dc:date>2007</dc:date>
          <dc:date>2007</dc:date>
          <dc:description>Based on the Extended-Maugis-Dugdale (EMD) elastic theory, an improved single asperity meniscus model considering asperity deformation due to both contact and adhesive forces was developed. Specifically included in this model was the solid surface interaction inside the contact area. It was found that due to asperity deformations, the capillary force of contacting asperities increases with increasing interference, rather than being a constant value as predicted by existing models. Moreover, when the asperity contacts with the substrate, the solid surface interaction inside the contact zone also contributes to the total adhesive force and it increases with increasing interference. This single asperity meniscus model was coupled with the Pearson surface statistical model to develop an improved elastic asymmetric meniscus surface model applicable to a wide-range of humidity levels and adhesion parameter values. By integrating the force-displacement curve, the adhesion energy per unit area was calculated for MEMS surfaces, which matched the experimental data very well from low to high relative humidity (RH) values, while the existing model greatly underestimated the adhesion energy at low RH..</dc:description>
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  Previous issue date: 2007</dc:description>
          <dc:description>Embargo set by: Seth Robbins for item 85173
Lift date: Forever
Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs</dc:description>
          <dc:description>Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs</dc:description>
          <dc:description>U of I Only</dc:description>
          <dc:description>155 p.</dc:description>
          <dc:description>Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2007.</dc:description>
          <dc:identifier>http://hdl.handle.net/2142/83892</dc:identifier>
          <dc:identifier>(MiAaPQ)AAI3290439</dc:identifier>
          <dc:language>eng</dc:language>
          <dc:subject>Engineering, Electronics and Electrical</dc:subject>
          <dc:title>Theoretical and Experimental Investigation of Adhesion in Microelectromechanical Systems</dc:title>
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            <department>Mechanical Engineering</department>
            <discipline>Mechanical Engineering</discipline>
            <grantor>University of Illinois at Urbana-Champaign</grantor>
            <level>Dissertation</level>
            <name>Ph.D.</name>
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