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oai:www.ideals.illinois.edu:2142/84321 2023-07-11 col_2142_5131 col_2142_14789 com_2142_5130 com_2142_14788 com_2142_8903

Gewirth, Andrew A. Stewart, Karen Lynn 2015-09-25T22:13:56Z 2015-09-25T22:13:56Z 10000-01-01 2008 2008 A third project investigated the effect of structure of corrosion inhibitors benzotriazole and 1,2,4-triazole (TAZ) on copper removal rate during CMP. Removal rates were higher for solutions containing TAZ than solutions containing BTA. The corrosion inhibitor films were characterized using AFM, cyclic voltammetry, impedance spectroscopy, surface-enhanced Raman spectroscopy, and mass spectrometry. Inhibitor films formed from TAZ were thicker, more permeable, and rougher than films formed from BTA. The addition of glycine to these solutions showed an increase in corrosion for the TAZ-covered surface, little change to the BTA-covered surface, and an increase in removal for both systems. This study correlated removal rate with the physical properties of these two different corrosion inhibitors. Made available in DSpace on 2015-09-25T22:13:56Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 3337930.pdf: 9511961 bytes, checksum: 2c7ba9608feeaab679476d2884d8746d (MD5) Previous issue date: 2008 Embargo set by: Seth Robbins for item 85602 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs U of I Only 166 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008. http://hdl.handle.net/2142/84321 (MiAaPQ)AAI3337930 eng Chemistry, Analytical Copper Surface Chemistry Relevant to Chemical Mechanical Planarization (Cmp) text Chemistry Chemistry University of Illinois at Urbana-Champaign Dissertation Ph.D.