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oai:www.ideals.illinois.edu:2142/85068 2023-07-11 col_2142_5131 col_2142_14800 com_2142_5130 com_2142_14799 com_2142_234

Geubelle, Philippe H. Zhu, Qi 2015-09-25T22:34:18Z 2015-09-25T22:34:18Z 10000-01-01 2001 2001 Finally, the three-dimensional finite element code is utilized to predict the viscoelastic response of a woven composite substrate for multilayer circuit board applications. Comparisons between numerical predictions and experimental data clearly indicate that the creep compliance of the composite depends not only on the relaxation of the matrix, but also on flexural deformations of the woven fabric bundles. Made available in DSpace on 2015-09-25T22:34:18Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 3017266.pdf: 6060762 bytes, checksum: 333bca0e2ad073e50d0b6e699003f069 (MD5) Previous issue date: 2001 Embargo set by: Seth Robbins for item 86349 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs U of I Only 123 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2001. http://hdl.handle.net/2142/85068 (MiAaPQ)AAI3017266 eng Engineering, Mechanical Dimensional Accuracy of Thermoset Polymer Composites: Process Simulation and Optimization text Aerospace Engineering Aerospace Engineering University of Illinois at Urbana-Champaign Dissertation Ph.D.