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        <datestamp>2023-07-11</datestamp>
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          <dc:language>eng</dc:language>
          <dc:contributor>Chasiotis, Ioannis</dc:contributor>
          <dc:creator>Jonnalagadda, Krishna Nagasai</dc:creator>
          <dc:date>2015-09-25T22:34:27Z</dc:date>
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          <dc:date>2008</dc:date>
          <dc:date>2008</dc:date>
          <dc:description>The results of this research provided fundamental information about thin film failure at the scale of MEMS, which could be directly applied to perform materials selection and design of MEMS components. The experimental methods described in this thesis were shown to be entirely repeatable and directly applicable to any thin film material. Consequently, they represent a protocol with the potential to become a standardized technique for mechanical property studies at the micron and the nanometer scales.</dc:description>
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  Previous issue date: 2008</dc:description>
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Lift date: Forever
Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs</dc:description>
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          <dc:title>Failure and Fracture of Thin Film Materials for MEMS</dc:title>
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