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oai:www.ideals.illinois.edu:2142/85110 2023-07-11 col_2142_5131 col_2142_14800 com_2142_5130 com_2142_14799 com_2142_234

Sottos, Nancy R. Kandula, Soma Sekhar Venkata 2015-09-25T22:34:27Z 2015-09-25T22:34:27Z 10000-01-01 2008 2008 A more complete description of the dynamic interfacial crack propagation is obtained by monitoring the crack tip location during the delamination event. The dynamic delamination technique eliminates the need for external contact and complex bonding processes. The stress wave generation is highly repeatable, multiple tests can be carried out on a single substrate, and final calculation of the interfacial energy does not require a complex stress analysis. Overall, this experimental methodology offers great potential to address the long standing problem of adhesive failure and delamination in multilayer thin film devices. Made available in DSpace on 2015-09-25T22:34:27Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 3314811.pdf: 1884221 bytes, checksum: da27a6b32916b29d459b3a3d6ff60323 (MD5) Previous issue date: 2008 Embargo set by: Seth Robbins for item 86391 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs U of I Only 100 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008. http://hdl.handle.net/2142/85110 (MiAaPQ)AAI3314811 eng Engineering, Mechanical Delamination of Thin Film Patterns Using Laser-Induced Stress Waves text Aerospace Engineering Aerospace Engineering University of Illinois at Urbana-Champaign Dissertation Ph.D.