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        <identifier>oai:www.ideals.illinois.edu:2142/85895</identifier>
        <datestamp>2023-07-11</datestamp>
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        <thesis xmlns="http://www.ndltd.org/standards/metadata/etdms/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:dc="http://purl.org/dc/elements/1.1/" xsi:schemaLocation="http://www.ndltd.org/standards/metadata/etdms/1.1/ http://www.ndltd.org/standards/metadata/etdms/1.1/etdms11.xsd http://purl.org/dc/elements/1.1/ http://www.ndltd.org/standards/metadata/etdms/1.1/etdmsdc.xsd">
          <dc:contributor>Stubbins, James F.</dc:contributor>
          <dc:creator>Li, Meimei</dc:creator>
          <dc:date>2015-09-28T14:50:56Z</dc:date>
          <dc:date>2015-09-28T14:50:56Z</dc:date>
          <dc:date>10000-01-01</dc:date>
          <dc:date>2003</dc:date>
          <dc:date>2003</dc:date>
          <dc:description>The fatigue performance of CuAl25 and CuCrZr and OFHC copper was also evaluated under creep-fatigue loading conditions. It was found that creep and stress relaxation have a major impact on fatigue behavior. Fatigue lives were reduced notably with hold time even at room temperature. Hold times are most damaging at low strain ranges and long fatigue lives. This effect was observed with hold periods as short as 10 seconds. Analysis revealed that the stress relaxation behavior during hold is comparable to transient creep behavior where dislocation glide is the dominant creep deformation mechanism. It was also determined that crack initiation and propagation at grain boundaries was accelerated under creep-fatigue loading conditions.</dc:description>
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  Previous issue date: 2003</dc:description>
          <dc:description>Embargo set by: Seth Robbins for item 87176
Lift date: Forever
Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs</dc:description>
          <dc:description>Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs</dc:description>
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          <dc:description>196 p.</dc:description>
          <dc:description>Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2003.</dc:description>
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          <dc:identifier>(MiAaPQ)AAI3086117</dc:identifier>
          <dc:language>eng</dc:language>
          <dc:subject>Engineering, Materials Science</dc:subject>
          <dc:title>Fatigue and Fracture Behavior of High Strength and High Conductivity Copper Alloys for High Heat Flux Applications</dc:title>
          <dc:type>text</dc:type>
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            <department>Nuclear Engineering</department>
            <discipline>Nuclear Engineering</discipline>
            <grantor>University of Illinois at Urbana-Champaign</grantor>
            <level>Dissertation</level>
            <name>Ph.D.</name>
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