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Sottos, Nancy R. Shrotriya, Pranav 2015-09-28T16:24:00Z 2015-09-28T16:24:00Z 10000-01-01 2001 2001 Numerical and experimental studies are performed to study residual deformation and warpage in a model multilayer circuit board construction of a common composite substrate (7628 fabric style). A numerical procedure based on classical lamination theory with non-isothermal viscoelastic constitutive relations is developed to predict the deformation and residual stress state due to relamination. Experimental values of the substrate stress relaxation modulus and coefficients of thermal expansion (CTE) are used as inputs in the numerical procedure to predict warpage of model circuit boards with a non-symmetric lay-up of 7628 style composite substrate. Boards with the exact same construction as used in the numerical analysis were fabricated according to the prescribed pressing cycle and the time dependent warpage measured using an ultrasonic contour scan technique. Comparison of the experimental warpage data with numerical predictions provides insight into the effects of processing cycle and substrate properties on residual stress development. Made available in DSpace on 2015-09-28T16:24:00Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 9996682.pdf: 5787290 bytes, checksum: 416bf8034324cd8cf1ea4f0d5fb7d253 (MD5) Previous issue date: 2001 Embargo set by: Seth Robbins for item 89058 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs U of I Only 141 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2001. http://hdl.handle.net/2142/87777 (MiAaPQ)AAI9996682 eng Engineering, Materials Science Dimensional Stability of Multilayer Circuit Boards text Theoretical and Applied Mechanics Theoretical and Applied Mechanics University of Illinois at Urbana-Champaign Dissertation Ph.D.