Topology optimization methods for heat sink design applied to power electronics

Lohan, Danny John

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https://hdl.handle.net/2142/106231 Copy

Description

Title

Topology optimization methods for heat sink design applied to power electronics

Author(s)

Lohan, Danny John

Issue Date

2019-12-04

Director of Research (if dissertation) or Advisor (if thesis)

Allison, James T.

Doctoral Committee Chair(s)

Allison, James T.

Committee Member(s)

• Tortorelli, Daniel
• Miljkovic, Nenad
• Wang, Pingfeng

Department of Study

Industrial&Enterprise Sys Eng

Discipline

Systems & Entrepreneurial Engr

Degree Granting Institution

University of Illinois at Urbana-Champaign

Degree Name

Ph.D.

Degree Level

Dissertation

Date of Ingest

2020-03-02T21:58:20Z

Keyword(s)

• Topology Optimization
• Heat Spreader Design
• Power Electronics

Abstract

Topology is defined here to relate the geometric properties and spatial relations unaffected by the continuous change of shape or size of physical engineering artifacts. Researchers have used topology optimization methods to design next-generation structural components for a wide variety of applications (e.g., automotive, aerospace, industrial machines, etc.). This has enabled improved part performance, reduced component volume, and the elimination or reduction of subsystem assembly steps through the use of a free-form structural design representation for commercial products. The free-form capability of topology optimization methods has enabled realization of novel parts otherwise difficult to obtain through the optimization of parametric models. In this dissertation, topology optimization methods are applied to design heat spreading structures for next-generation power electronic systems. Wide band-gap semiconductor devices provide an opportunity to operate next-generation power electronics at higher temperature. The resulting increase in temperature capability is not shared by all components within a power electronic circuit, and careful consideration must be taken when routing heat throughout the system. Topology optimization methods provide a flexible and powerful solution to address challenges associated with these next generation electronic systems. First, a framework to classify general topology optimization problems is presented. This framework draws upon research from multiple application domains and defines a unifying language. Then, some practical heat conduction formulations for topology optimization are reviewed. This includes an analysis of common objective functions, in addition to some practical formulations for power electronics. Next, topology optimization methods are applied to design a heat spreader for a next-generation power inverter. The topologically-optimized design is fabricated and benchmarked against a baseline heat sink design. These studies motivated an investigation of reduced-order convection models for topology optimization, where experimental evaluation was used to assess heat spreader performance. The topology of the best-performing structure motivated a critical look at the structural representations used in topology optimization. For heat spreader design, it is common to use maximum approximation functions within a topology optimization. Several maximum approximation functions are analyzed in detail for use as optimization objectives and constraints. Advancing these topology optimization methods extends the envelope of design capabilities and therein lies the future of next generation power systems.

Graduation Semester

2019-12

Type of Resource

text

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http://hdl.handle.net/2142/106231

Copyright and License Information

Copyright 2019 Danny John Lohan

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