Development of standard components for multi-degrees-of-freedom mems positioning stages with closed-loop feedback

Koo, Bonjin

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https://hdl.handle.net/2142/109498 Copy

Description

Title

Development of standard components for multi-degrees-of-freedom mems positioning stages with closed-loop feedback

Author(s)

Koo, Bonjin

Issue Date

2020-11-23

Director of Research (if dissertation) or Advisor (if thesis)

Ferreira, Placid

Doctoral Committee Chair(s)

Ferreira, Placid

Committee Member(s)

• Salapaka , Srinivasa
• Kapoor , Shiv
• Kesavadas , Thenkurussi
• Mensing , Glennys

Department of Study

Mechanical Sci & Engineering

Discipline

Mechanical Engineering

Degree Granting Institution

University of Illinois at Urbana-Champaign

Degree Name

Ph.D.

Degree Level

Dissertation

Keyword(s)

MEMS, Positioning stages, Parallel kinematics

Abstract

Devices at the micro and nano scale are playing a significant role in a variety of fields such as electronics, micro-fluidics, bio-medical applications, and MEMS in micro-electro-mechanical systems. These miniaturized devices have advantages such as higher efficiency, less power consumption, and higher sensitivity than their macro counterparts. Especially, silicon-based multi-degree-of-freedom (DOF) MEMS positioning stages are critical to modern micro- and nano-manipulation and manufacturing technologies. Due to their ability to regulate displacement and forces with high dynamic range along with high resolution and accuracy, they play an important role to improve performance in micro-machining, micro-assembly, and micro-alignment processes. This research presents the design, analysis, simulation, fabrication, characterization, and control of multi-degree-of-freedom (DOF) closed-loop micro-positioning stages. The micro-positioning platforms were developed by the implementation of parallel kinematic mechanisms and transducers at the micro-scale and increased structural stiffness and natural frequency of the system in a favorable way. They were fabricated on SOI and double-sided SOI wafers with standard photolithography patterning processes followed by a series of dry and wet etching process steps to release the devices. The positioning loop of the fabricated device is closed using a commercially-off-the-shelf (COTS) capacitance-to-voltage conversion IC and characterized by a PID controller built into a dSPACE control platform. The performance of integrated processing elements were demonstrated by static and dynamic experiments including surface tensiometer application.

Graduation Semester

2020-12

Type of Resource

Thesis

Permalink

http://hdl.handle.net/2142/109498

Copyright and License Information

Copyright 2020 Bonjin Koo

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