Subsurface 3D integrated photonic devices

Huang, Jack

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https://hdl.handle.net/2142/120574 Copy

Description

Title

Subsurface 3D integrated photonic devices

Author(s)

Huang, Jack

Issue Date

2023-05-01

Director of Research (if dissertation) or Advisor (if thesis)

Goddard, Lynford L

Department of Study

Electrical & Computer Eng

Discipline

Electrical & Computer Engr

Degree Granting Institution

University of Illinois at Urbana-Champaign

Degree Name

M.S.

Degree Level

Thesis

Keyword(s)

• Integrated Photonics
• Photonics Integrated Circuits
• Mach-Zehnder Interferometers
• Microring Resonators
• Two-photon Lithography

Abstract

In recent years, there has been tremendous interest in photonic integrated circuits (PICs) for various applications such as communications, computing, and sensing. However, much of the existing works leverage traditional planar silicon photonics with limited integration density. In principle, volumetric photonic integrated circuits (VPICs) based on two-photon polymerization (TPP) enable the ability to massively integrate micron scale photonic elements within the volume of a substrate wafer, as opposed to traditional planar silicon photonics. To this end, we demonstrate the ability to fabricate high performing passive photonic devices - Mach-Zehnder interferometers and microring resonators. In particular, we will discuss the physical theory and engineering aspects of these two VPIC devices, as well as their fabrication and testing results.

Graduation Semester

2023-05

Type of Resource

Thesis

Handle URL

https://hdl.handle.net/2142/120574

Copyright and License Information

Copyright 2023 Jack Huang

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