Design automation and analysis of power distribution networks and chiplet-to-chiplet communication interfaces in 2.5D advanced packaging technologies
Sun, Haofeng
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https://hdl.handle.net/2142/122183
Description
Title
Design automation and analysis of power distribution networks and chiplet-to-chiplet communication interfaces in 2.5D advanced packaging technologies
Author(s)
Sun, Haofeng
Issue Date
2023-12-07
Director of Research (if dissertation) or Advisor (if thesis)
Schutt-Aine, Jose E
Department of Study
Electrical & Computer Eng
Discipline
Electrical & Computer Engr
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
M.S.
Degree Level
Thesis
Keyword(s)
PDN
Design Automation
HFSS
BoW
Abstract
This thesis presents a comprehensive design automation workflow for modeling and analyzing the power distribution networks in 2.5D advanced packaging for heterogeneous integration applications. Challenges related to the routing schemes, 3D model construction time, and simulation complexity are identified, and temporary solutions are deliberated. Multiple test cases involving power distribution networks and high-speed via pairs are implemented with the automation workflow, and the results are analyzed. Finally, bunch of wires, an open source chiplet-to-chiplet interface, is introduced and the progress towards the design automation is discussed.
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