Thermo-optic Phase Spectroscopy techniques for multiscale thermal conductance characterization in semiconductor integrated circuits
Sun, Jinchi
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https://hdl.handle.net/2142/132746
Description
Title
Thermo-optic Phase Spectroscopy techniques for multiscale thermal conductance characterization in semiconductor integrated circuits
Author(s)
Sun, Jinchi
Issue Date
2025-10-10
Director of Research (if dissertation) or Advisor (if thesis)
Cahill, David G.
Doctoral Committee Chair(s)
Cahill, David G.
Committee Member(s)
Cao, Qing
Sinha, Sanjiv
Anderson, Christopher P.
Department of Study
Materials Science & Engineerng
Discipline
Materials Science & Engr
Degree Granting Institution
University of Illinois Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Thermo-optic Phase Spectroscopy (TOPS)
Thermal conductance characterization
Semiconductor integrated circuits
AC laser heating
Probe beam deflection
Multiscale thermal analysis
3D IC architectures
Buried interfaces
Thermal boundary conductance
Nanoscale thin films
Language
eng
Abstract
Thermal management remains a critical challenge in the advancement of semiconductor integrated circuits, particularly with the emergence of three-dimensional (3D) architectures for high-performance applications. This thesis introduces Thermo-optic Phase Spectroscopy (TOPS), a family of non-destructive techniques for multiscale thermal conductance characterization across bulk materials, buried films and interfaces, and nanoscale films.
Three variants are developed: Displacement TOPS (D-TOPS) for bulk solids, Immersion TOPS (I-TOPS) for deeply embedded films and interfaces, and High-Resolution TOPS (HR-TOPS) for nanoscale semiconductor films. Each technique combines AC laser heating, temperature sensing via probe beam deflection, and analytical modeling to extract thermal properties with high spatial resolution, sensitivity, and speed. A unified modeling framework accommodates multilayer structures with anisotropic thermal expansion and elastic constants. Experimental validation demonstrates TOPS’s ability to extract thermal conductivity and thermal boundary conductance with improved accuracy and reduced acquisition time compared to conventional methods.
By enabling precise thermal conductance characterization across multiple scales, TOPS provides essential data for optimizing fabrication processes, improving thermal simulations, and guiding temperature sensor placement in next-generation IC designs.
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