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Compliant Meso-Scale Grinding of Silicon
Doctoral Committee Chair(s)
Philpott, Michael L.
Shannon, Mark A.
Department of Study
Degree Granting Institution
University of Illinois at Urbana-Champaign
Engineering, Materials Science
To further improve form accuracy obtained on the compliant grinding apparatus, a normal grinding force model and a depth of cut model were developed to account for the large compliance in the grinding system. Numerical simulation was performed to predict actual depths of cut and the results were within 6% of the measured/actual depths.